CMT Blog

CMT Field Notes - 2016 European Thermoforming Conference Review

Posted by Conor Carlin on 4:34 PM on March 22, 2016

Our friends in Europe certainly know how to organize a conference. Of course, hosting the event on the Catalan coast of northern Spain provides plenty of incentive for people to attend. This year was the 10th conference sponsored by the European Thermoforming Division of SPE. With a record 245 attendees from 27 countries, it was an international affair covering topics such as 3D printing, recycling, in-mold labelling, and creative design. A strong academic presence also ensured that the math geeks in the audience got their fair share of computer-based simulation models related to sheet temperature control, a subject that is central to the science of thermoforming.

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CMT Materials Launches New Website

Posted by CMTUpdate on 10:27 AM on February 4, 2016

We are delighted to announce that our new website is live! After a few years, a little facelift was in order. The new design is crisper, cleaner with updated photos, case studies and technical guides. We know that content is king, so we continue to work on developing new white papers and case studies for both thin-gauge and heavy-gauge thermoforming applications. Let us know what you think.

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2015 Year in Review

Posted by CMTUpdate on 4:56 PM on December 22, 2015

Ah, December. The time of year when the days are shorter, the nights are longer, and you wonder what UPS 2-day shipping really means on the 24th. The internet abounds with lists and reviews, top 5 this and top 10 that. We're not immune to the seductive power of nostalgia so we're going to indulge in a wee bit of reflection on the year that was. 

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CMT Field Notes: 2015 European Thin Wall Packaging Conference

Posted by Conor Carlin on 4:54 PM on December 8, 2015

This year marked the 10th anniversary of AMI’s Thin Wall Packaging Conference in Europe. What started as a small gathering with only 48 people in 2005 is now an important industry event that consistently draws over 200 delegates. Brand owners, resin suppliers, converters and OEMs from both sides of the Atlantic are drawn to the city of Cologne to hear the latest developments in materials and processes for thermoformed and injection molded thin wall packaging. With conferences already established in Europe and North America, AMI is expanding to Southeast Asia next year with a new event in Singapore (September 20-21).

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HYVAC LCM in the News

Posted by CMTUpdate on 4:57 PM on November 23, 2015

Since we introduced HYVAC LCM at the 2015 Thermoforming Conference, we have had a steady flow of interest in the new mold material. The good people over at Plastics Machinery Magazine recently published a concise and informative piece on the new material.  As stated in the article, we're still limiting the number of projects until we optimize the process for making molds.

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CMT Announces Product Update

Posted by CMTUpdate on 1:11 PM on October 7, 2015

This week we are sending a notice to those customers who use our co-polymer syntactic foam materials: HYTAC FLX, FLXT and C1R. The text of the email can be seen below. HYTAC W, WF, WFT, B1X and XTL are not affected by this change.

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2015 Thermoforming Conference Review

Posted by CMTUpdate on 4:27 PM on September 11, 2015

Our time in Atlanta seemed to come and go very quickly, probably because we spent most of that time talking to customers, partners and industry colleagues. We had several meetings booked in advance which usually ensures meaningful conversation, and this year was no exception. In particular, our senior materials engineer and co-founder, Noel Tessier, came back to the show to meet with Dr. Peter Martin of Queens University, Belfast. These two eminent minds have worked on several papers related to plug assists over the years, and it looks like we might have some new findings to publish in the near future. Stay tuned.

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2015 SPE Thermoforming Conference Preview

Posted by CMTUpdate on 3:28 PM on August 4, 2015

The annual SPE Thermoforming Conference starts early this year - August 31 in Atlanta, GA. CMT will be there in booth 325-327 with our full spectrum of tooling materials: HYTAC syntactic foam for plug assists; Metapor porous aluminum; RenShape tooling and modeling board; cutting tools and machining guides.

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Field Notes: 2014 European Thermoforming Conference - Part 1

Posted by Conor Carlin on 3:46 PM on April 9, 2014

Over 200 delegates from 27 countries attended the 9th annual European Thermoforming Conference in the glorious Bohemian capital city that is Prague. The theme of the event was billed as "Forming a Sustainable Future" with major topical focus on innovation and competitiveness. Both heavy-gauge and thin-gauge sectors were well-represented in the technical program.

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CMT Materials Exhibits HYTAC at ProPak Indonesia

Posted by CMTUpdate on 7:00 AM on November 19, 2013

The 2013 ProPak tradeshow will be in Jakarta, Indonesia this week. CMT will be there to showcase HYTAC syntactic foam plug assist materials, especially XTL, and to meet toolmakers and thermoformers from around the region. Southeast Asia is a fertile ground for thermoforming as evidenced by strong growth in packaging markets according to Euromonitor International. In fact, at the AMI Thin Wall Packaging Conference earlier this year, Euromonitor reported 6% CAGR in retail unit volume growth from 2007-2012. Asia, and Indonesia in particular, is clearly the fastest growing market for retail plastic packaging of which thermoformed cups and trays play a signifcant part.

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